Three
Five (III-V) Compounds, Inc. is proud to introduce a true surface
mountable packaged
Photodiode. This new device has a super low profile (1.1 mm) and an overall
dimension of 5 x 4 x 1.1 mm. It can accept a PIN photodiode chip with an active
area up to 10 mm square. In order to meet the strict requirements for different
sensing applications, this device comes in 3 different versions: standard clear
encapsulation lens for responsivity from visible to 1000nm; a red encapsulant
lens for applications that are required to filter out visible ambient light
interference; and a black encapsulant lens for application where higher
responsivity in the infrared region is required. These devices are provided on
tape and reel with 1000 parts per reel for convenient pick and place usage.
Technical specifications:
TFMD5000
TFMD5000R
TFMD5000B
